Phenol, 4,4′-cyclohexylidenebis[2-amino- CAS#: 30817-90-4; 凯望编码 (ChemWhat Code): 1490905
Identification
| 英文名 | Phenol, 4,4′-cyclohexylidenebis[2-amino- |
| IUPAC Name | 2-amino-4-[1-(3-amino-4-hydroxyphenyl)cyclohexyl]phenol |
| 分子结构 |  |
| CAS编号 | Phenol, 4,4′-cyclohexylidenebis[2-amino- CAS#: 30817-90-4 |
| EINECS Number | No data available |
| MDL Number | No data available |
| Beilstein Registry Number | No data available |
| 别名 | 2-amino-4-[1-(3-amino-4-hydroxyphenyl)cyclohexyl]phenol Phenol, 4,4′-cyclohexylidenebis[2-amino-; 4,4′-(Cyclohexane-1,1-diyl)bis(2-aminophenol); SCHEMBL13784870; 2-amino-4-[1-(3-amino-4-hydroxyphenyl)cyclohexyl]phenol; DTXSID00458481; SY347430; 4,4 inverted exclamation mark -(Cyclohexane-1,1-diyl)bis(2-aminophenol); 2-amino-4-[1-(3-amino-4-hydroxy-phenyl)cyclohexyl]phenol; 2-azanyl-4-[1-(3-azanyl-4-oxidanyl-phenyl)cyclohexyl]phenol |
| 分子式 | C18H22N2O2 |
| 分子量 | 298.379 |
| InChI | InChI=1S/C18H22N2O2/c19-14-10-12(4-6-16(14)21)18(8-2-1-3-9-18)13-5-7-17(22)15(20)11-13/h4-7,10-11,21-22H,1-3,8-9,19-20H2 |
| InChI Key | BOVSSHUURZCDRR-UHFFFAOYSA-N |
| Canonical SMILES | Oc1ccc(cc1N)C3(c2cc(N)c(O)cc2)CCCCC3 |
| Patent Information |
| No data available |
Physical Data
| Appearance | White to off-white solid |
| Boiling Point | 518.8±50.0 °C(Predicted) |
| Boiling Point, °C |
| 251 |
| 250 – 252 |
| Density, g·cm-3 | Reference Temperature, °C | Measurement Temperature, °C |
| 1.271 |
Spectra
| No data available |
Route of Synthesis (ROS)
| No data available |
Safety and Hazards
| GHS Hazard Statements | No data available |
Other Data
| Transportation | NONH for all modes of transport |
| Under the room temperature and away from light | |
| HS Code | No data available |
| Storage | Under the room temperature and away from light |
| Shelf Life | 1 year |
| Market Price | USD |
| Use Pattern |
| Phenol, 4,4′-cyclohexylidenebis[2-amino- CAS 30817-90-4 is used as a curing agent for epoxy resins in integrated circuit (IC) packaging. It enhances the glass transition temperature (Tg) of the resin, improving its performance under high temperatures. The resulting crosslinked network provides excellent mechanical strength, protecting ICs from external stress. Its hydrophobic structure improves moisture resistance, ensuring long-term reliability of the packaging. Additionally, it helps lower the coefficient of thermal expansion (CTE), reducing the risk of interfacial failure during thermal cycling. |
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认证生产商 | |
| Warshel Chemical Ltd | http://www.warshel.com/ |
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| Watson International Limited | 访问Watson官网 |
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